3 Reasons Why You Should Use Underfill With Smaller Chips

1 May 2015
 Categories: Industrial & Manufacturing, Blog

Computers continue to get smaller. This is excellent because this means that we have an increasing amount of computer power at our fingertips, wherever we go, but it's also a problem because we can only make chips so small before they become fragile.

If you've ever dropped your phone, you know that you don't want the chip that's running your phone to be breakable at all. This is where underfill comes in. There are three main reasons why underfill should be used with smaller chips:

1. Provides Support

Underfill is bonded directly with the chip itself. This means that it is able to provide a higher level of support to the chips, keeping it from snapping in half, redistributing some of the stress that the chip might be under, and directly protecting the tiny, soldered joints.

This is critical because without underfill, it would be difficult for a chip to maintain its structural integrity when it is under a great deal of stress, requiring it to be replaced on a more regular basis.

2. Gets Heat Away From the Chip

Computers generate more heat than we realize. If you've ever heard a whirring noise in an older laptop, that's the fan desperately trying to keep the heat away from the small, sensitive computer parts. Underfill also helps with this job.

When it is bonded to the chip, underfill leeches away heat and causes it to be dissipated throughout the computer, rather than be focused on the small, fragile chip. Certain underfill jobs can even act as a genuine heat sink, rather than just an extra layer that absorbs the heat of what it's covering.

3. Helps Chip Endure High-Gravitational Acceleration

When a chip is accelerated to a point where it is experiencing a high level of G-force, then it could be damaged. This is because the G-force puts a high level of stress on the chip and will cause it to pop out or experience internal pressure. Although underfill cannot stop this internal pressure, it can help the chip endure it more effectively by shoring up the chip's sides until whatever is causing the elevated G-force has ended.

This is important for computers on satellites and for computers on spacecraft because they often experience high G-force that their computers need to cope with without being damaged.

For more information, talk to a company that specializes in manufacturing and installing underfill. To learn more, contact a company like Alltemated Inc. with any questions you have.